Dynamic random-access memory in the context of Semiconductor memory


Dynamic random-access memory in the context of Semiconductor memory

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⭐ Core Definition: Dynamic random-access memory

Dynamic random-access memory (dynamic RAM or DRAM) is a type of random-access semiconductor memory that stores each bit of data in a memory cell. A DRAM memory cell usually consists of a tiny capacitor and a transistor, both typically based on metal–oxide–semiconductor (MOS) technology.

While most DRAM memory cell designs use a capacitor and transistor, some only use two transistors. In the designs where a capacitor is used, the capacitor can either be charged or discharged; these two states are taken to represent the two values of a bit, conventionally called 0 and 1. The electric charge on the capacitors gradually leaks away; without intervention, the data on the capacitor would soon be lost. To prevent this, DRAM requires an external memory refresh circuit which periodically rewrites the data in the capacitors, restoring them to their original charge. This refresh process is the defining characteristic of dynamic random-access memory, in contrast to static random-access memory (SRAM) which does not require data to be refreshed. Unlike flash memory, DRAM is volatile memory (as opposed to non-volatile memory), since it loses its data quickly when power is removed. However, DRAM does exhibit limited data remanence.

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Dynamic random-access memory in the context of Processor register

A processor register is a quickly accessible location available to a computer's processor. Registers usually consist of a small amount of fast storage, although some registers have specific hardware functions, and may be read-only or write-only. In computer architecture, registers are typically addressed by mechanisms other than main memory, but may in some cases be assigned a memory address e.g. DEC PDP-10, ICT 1900.

Almost all computers, whether load/store architecture or not, load items of data from a larger memory into registers where they are used for arithmetic operations, bitwise operations, and other operations, and are manipulated or tested by machine instructions. Manipulated items are then often stored back to main memory, either by the same instruction or by a subsequent one. Modern processors use either static or dynamic random-access memory (RAM) as main memory, with the latter usually accessed via one or more cache levels.

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Dynamic random-access memory in the context of Random-access memory

Random-access memory (RAM; /ræm/) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks and magnetic tape), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement.

In modern technology, random-access memory takes the form of integrated circuit (IC) chips with MOS (metal–oxide–semiconductor) memory cells. RAM is normally associated with volatile types of memory where stored information is lost if power is removed. The two main types of volatile random-access semiconductor memory are static random-access memory (SRAM) and dynamic random-access memory (DRAM).

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Dynamic random-access memory in the context of SK Hynix

SK Hynix Inc. (Korean: 에스케이하이닉스 주식회사) is a South Korean supplier of dynamic random-access memory (DRAM) chips and flash memory chips. SK Hynix is one of the world's largest semiconductor vendors.

Founded as Hyundai Electronics in 1983, SK Hynix was integrated into the SK Group in 2012 following a series of mergers, acquisitions, and restructuring efforts. After being incorporated into the SK Group, SK Hynix became a major affiliate alongside SK Innovation and SK Telecom.

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Dynamic random-access memory in the context of SDRAM

Synchronous dynamic random-access memory (synchronous dynamic RAM or SDRAM) is any DRAM where the operation of its external pin interface is coordinated by an externally supplied clock signal.

DRAM integrated circuits (ICs) produced from the early 1970s to the early 1990s used an asynchronous interface, in which input control signals have a direct effect on internal functions delayed only by the trip across its semiconductor pathways. SDRAM has a synchronous interface, whereby changes on control inputs are recognised after a rising edge of its clock input. In SDRAM families standardized by JEDEC, the clock signal controls the stepping of an internal finite-state machine that responds to incoming commands. These commands can be pipelined to improve performance, with previously started operations completing while new commands are received. The memory is divided into several equally sized but independent sections called banks, allowing the device to operate on a memory access command in each bank simultaneously and speed up access in an interleaved fashion. This allows SDRAMs to achieve greater concurrency and higher data transfer rates than asynchronous DRAMs could.

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Dynamic random-access memory in the context of Ferroelectric RAM

Ferroelectric RAM (FeRAM, F-RAM or FRAM) is a random-access memory similar in construction to DRAM but using a ferroelectric layer instead of a dielectric layer to achieve non-volatility. FeRAM is an alternative non-volatile random-access memory technology that offers the same functionality as flash memory. An FeRAM chip contains a thin film of ferroelectric material, often lead zirconate titanate, commonly referred to as PZT. The atoms in the PZT layer change polarity in an electric field, thereby producing a power-efficient binary switch. However, the most important aspect of the PZT is that it is not affected by power disruption or magnetic interference, making FeRAM a reliable nonvolatile memory.

FeRAM's advantages over Flash include: lower power usage, faster write speeds and a much greater maximum read/write endurance (about 10 to 10 cycles). FeRAMs have data retention times of more than 10 years at +85 °C (and decades at lower temperatures). The primary disadvantages of FeRAM are much lower storage densities than flash devices, storage capacity limitations and higher cost. Like DRAM, FeRAM's read process is destructive, necessitating a write-after-read architecture.

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Dynamic random-access memory in the context of Static RAM

Static random-access memory (static RAM or SRAM) is a type of random-access memory (RAM) that uses latching circuitry (flip-flop) to store each bit. SRAM is volatile memory; data is lost when power is removed.

The static qualifier differentiates SRAM from dynamic random-access memory (DRAM):

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Dynamic random-access memory in the context of TRS-80

The TRS-80 Micro Computer System (TRS-80, colloquially known as the "Trash-80", later renamed the TRS-80 Model I to distinguish it from its successors) is a desktop microcomputer developed by American company Tandy Corporation and sold through their Radio Shack stores. Launched in 1977, it is one of the earliest mass-produced and mass-marketed retail home computers. The name is derived from Tandy Radio Shack Z80, referring to its Zilog Z80 8-bit microprocessor.

The TRS-80 has a full-stroke QWERTY keyboard, 4 KB DRAM standard memory, small size and desk area, floating-point Level I BASIC language interpreter in ROM, 64-character-per-line video monitor, and had a starting price of US$600 (equivalent to US$3,100 in 2024). A cassette tape drive for program storage was included in the original package. While the software environment was stable, the cassette load/save process combined with keyboard bounce issues and a troublesome Expansion Interface contributed to the Model I's reputation as not well-suited for serious use. Initially (until 1981), it lacked support for lowercase characters which may have hampered business adoption. An extensive line of upgrades and peripherals for the TRS-80 were developed and marketed by Tandy/Radio Shack. The basic system can be expanded with up to 48 KB of RAM, and up to four floppy disk drives and/or hard disk drives. Tandy/Radio Shack provided full-service support including upgrade, repair, and training services in their thousands of stores worldwide.

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Dynamic random-access memory in the context of 3D XPoint

3D XPoint (pronounced three-D cross point) is a discontinued non-volatile memory (NVM) technology developed jointly by Intel and Micron Technology. It was announced in July 2015 and was available on the open market under the brand name Optane (Intel) from April 2017 to July 2022. Bit storage is based on a change of bulk resistance, in conjunction with a stackable cross-grid data access array, using a technology known as Ovonic Threshold Switch (OTS). Initial prices were less than dynamic random-access memory (DRAM) but more than flash memory.

As a non-volatile memory, 3D XPoint had a number of features that distinguish it from other currently available RAM and NVRAM. Although the first generations of 3D XPoint were not especially large or fast, 3D XPoint was used to create some of the fastest SSDs available as of 2019, with low write latency. As the memory was inherently fast, and byte-addressable, techniques such as read-modify-write and caching used to enhance traditional SSDs are not needed to obtain high performance. In addition, chipsets such as Cascade Lake were designed with inbuilt support for 3D XPoint, which allowed it to be used as a caching or acceleration disk, and it was also fast enough to be used as non-volatile RAM (NVRAM) or persistent memory in a DIMM package.

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Dynamic random-access memory in the context of DDR4 SDRAM

Double Data Rate 4 Synchronous Dynamic Random-Access Memory (DDR4 SDRAM) is a type of synchronous dynamic random-access memory with a high-bandwidth ("double data rate") interface.

Released to the market in 2014, it is a variant of dynamic random-access memory (DRAM), some of which have been in use since the early 1970s, and a higher-speed successor to the DDR2 and DDR3 technologies.

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