Strain (materials science) in the context of Parts-per notation

Thermal shock is a phenomenon characterized by a rapid change in temperature that results in a transient mechanical load on an object. The load is caused by the differential expansion of different parts of the object due to the temperature change. This differential expansion can be understood in terms of strain, rather than stress. When the strain exceeds the tensile strength of the material, it can cause cracks to form, and eventually lead to structural failure.

Methods to prevent thermal shock include:

The bulk modulus (${\displaystyle K}$ or ${\displaystyle B}$ or ${\displaystyle k}$) of a substance is a measure of the resistance of a substance to bulk compression. It is defined as the ratio of the infinitesimal pressure increase to the resulting relative decrease of the volume.

Other moduli describe the material's response (strain) to other kinds of stress: the shear modulus describes the response to shear stress, and Young's modulus describes the response to normal (lengthwise stretching) stress. For a fluid, only the bulk modulus is meaningful. For a complex anisotropic solid such as wood or paper, these three moduli do not contain enough information to describe its behaviour, and one must use the full generalized Hooke's law. The reciprocal of the bulk modulus at fixed temperature is called the isothermal compressibility.

In physics and engineering, a constitutive equation or constitutive relation is a relation between two or more physical quantities (especially kinetic quantities as related to kinematic quantities) that is specific to a material or substance or field, and approximates its response to external stimuli, usually as applied fields or forces. They are combined with other equations governing physical laws to solve physical problems; for example in fluid mechanics the flow of a fluid in a pipe, in solid state physics the response of a crystal to an electric field, or in structural analysis, the connection between applied stresses or loads to strains or deformations.

Some constitutive equations are simply phenomenological; others are derived from first principles. A common approximate constitutive equation frequently is expressed as a simple proportionality using a parameter taken to be a property of the material, such as electrical conductivity or a spring constant. However, it is often necessary to account for the directional dependence of the material, and the scalar parameter is generalized to a tensor. Constitutive relations are also modified to account for the rate of response of materials and their non-linear behavior. See the article Linear response function.

In continuum mechanics, shearing refers to the occurrence of a shear strain, which is a deformation of a material substance in which parallel internal surfaces slide past one another. It is induced by a shear stress in the material. Shear strain is distinguished from volumetric strain. The change in a material's volume in response to stress and change of angle is called the angle of shear.

In materials science and solid mechanics, Poisson's ratio (symbol: ν (nu)) is a measure of the Poisson effect, the deformation (expansion or contraction) of a material in directions perpendicular to the specific direction of loading. The value of Poisson's ratio is the negative of the ratio of transverse strain to axial strain. For small values of these changes, ν is the amount of transversal elongation divided by the amount of axial compression.

Most materials have Poisson's ratio values ranging between 0.0 and 0.5. For soft materials, such as rubber, where the bulk modulus is much higher than the shear modulus, Poisson's ratio is near 0.5. For open-cell polymer foams, Poisson's ratio is near zero, since the cells tend to collapse in compression. Many typical solids have Poisson's ratios in the range of 0.2 to 0.3.

In mechanics and materials science, strain rate is the time derivative of strain of a material. Strain rate has dimension of inverse time and SI units of inverse second, s (or its multiples).

The strain rate at some point within the material measures the rate at which the distances of adjacent parcels of the material change with time in the neighborhood of that point. It comprises both the rate at which the material is expanding or shrinking (expansion rate), and also the rate at which it is being deformed by progressive shearing without changing its volume (shear rate). It is zero if these distances do not change, as happens when all particles in some region are moving with the same velocity (same speed and direction) and/or rotating with the same angular velocity, as if that part of the medium were a rigid body.

A piezoelectric sensor is a device that uses the piezoelectric effect to measure changes in pressure, acceleration, temperature, strain, or force by converting them to an electrical charge. The prefix piezo- is Greek for 'press' or 'squeeze'.

Digital image correlation and tracking is an optical method that employs tracking and image registration techniques for accurate 2D and 3D measurements of changes in 2D images or 3D volumes. This method is often used to measure full-field displacement and strains, and it is widely applied in many areas of science and engineering. Compared to strain gauges and extensometers, digital image correlation methods provide finer details about deformation, due to the ability to provide both local and average data.

SiGe (/ˈsɪɡiː/ or /ˈsaɪdʒiː/), or silicon–germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si_1−xGe_x. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. IBM introduced the technology into mainstream manufacturing in 1989. This relatively new technology offers opportunities in mixed-signal circuit and analog circuit IC design and manufacture. SiGe is also used as a thermoelectric material for high-temperature applications (>700 K).