Laser cutting in the context of "T-shirt"

A laser is a device that emits light through a process of optical amplification based on the stimulated emission of electromagnetic radiation. The word laser originated as an acronym for light amplification by stimulated emission of radiation. The first laser was built in 1960 by Theodore Maiman at Hughes Research Laboratories, based on theoretical work by Charles H. Townes and Arthur Leonard Schawlow and the optical amplifier patented by Gordon Gould.

A laser differs from other sources of light in that it emits light that is coherent. Spatial coherence allows a laser to be focused to a tight spot, enabling uses such as optical communication, laser cutting, and lithography. It also allows a laser beam to stay narrow over great distances (collimation), used in laser pointers, lidar, and free-space optical communication. Lasers can also have high temporal coherence, which permits them to emit light with a very narrow frequency spectrum. Temporal coherence can also be used to produce ultrashort pulses of light with a broad spectrum but durations measured in attoseconds.

Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an offshoot of the printed circuit board industry. Photo etching can produce highly complex parts with very fine detail accurately and economically.

This process can offer economical alternatives to stamping, punching, laser or water jet cutting, or wire electrical discharge machining (EDM) for thin gauge precision parts. The tooling is inexpensive and quickly produced. This makes the process useful for prototyping and allows for easy changes in mass production. It maintains dimensional tolerances and does not create burrs or sharp edges. It can make a part in hours after receiving the drawing.

A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not. Like molds, dies are generally customized to the item they are used to create.

Products made with dies range from simple paper clips to complex pieces used in advanced technology. Continuous-feed laser cutting may displace the analogous die-based process in the automotive industry, among others.

Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy.Following the dicing process the individual silicon chips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.

During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade with diamond particles, rotating at 30,000 RPM and cooled with deionized water. Once a wafer has been diced, the pieces left on the dicing tape are referred to as die, dice or dies. Each will be packaged in a suitable package or placed directly on a printed circuit board substrate as a "bare die". The areas that have been cut or sawn away, called die streets, are typically about 75 micrometres (0.003 inch) wide. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted by die-handling equipment, such as a die bonder or die sorter, further in the electronics assembly process.

Laser cooling includes several techniques where atoms, molecules, and small mechanical systems are cooled with laser light. The directed energy of lasers is often associated with heating materials, e.g. laser cutting, so it can be counterintuitive that laser cooling often results in sample temperatures approaching absolute zero. It is routinely used in atomic physics experiments where the laser-cooled atoms are manipulated and measured, or in technologies, such as atom-based quantum computing architectures.

Laser cooling reduces the random motion of particles or the random vibrations of mechanical systems. For atoms and molecules this reduces Doppler shifts in spectroscopy, allowing for high precision measurements and instruments such as optical clocks. The reduction in thermal energy also allows for efficient loading of atoms and molecules into traps where they can be used in experiments or atom-based devices for longer periods of time.