Fairchild Semiconductor in the context of Deal–Grove model

Complementary metal–oxide–semiconductor (CMOS, pronounced "sea-moss", /siːmɑːs/, /-ɒs/) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS overtook NMOS logic as the dominant MOSFET fabrication process for very large-scale integration (VLSI) chips in the 1980s, replacing earlier transistor–transistor logic (TTL) technology at the same time. CMOS has since remained the standard fabrication process for MOSFET semiconductor devices. As of 2011, 99% of IC chips, including most digital, analog and mixed-signal ICs, were fabricated using CMOS technology.

In 1948, Bardeen and Brattain patented an insulated-gate transistor (IGFET) with an inversion layer. Bardeen's concept forms the basis of CMOS technology today. The CMOS process was presented by Fairchild Semiconductor's Frank Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. RCA commercialized the technology with the trademark "COS-MOS" in the late 1960s, forcing other manufacturers to find another name, leading to "CMOS" becoming the standard name for the technology by the early 1970s. Two important characteristics of CMOS devices are high noise immunity and low static power consumption. Since one transistor of the MOSFET pair is always off, the series combination draws significant power only momentarily during switching between on and off states. Consequently, CMOS devices do not produce as much waste heat as other forms of logic, like NMOS logic or transistor–transistor logic (TTL), which normally have some standing current even when not changing state. These characteristics allow CMOS to integrate a high density of logic functions on a chip. It was primarily for this reason that CMOS became the most widely used technology to be implemented in VLSI chips.

The semiconductor industry is the aggregate of companies engaged in the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits. Its roots can be traced to the invention of the transistor by Shockley, Brattain, and Bardeen at Bell Labs in 1948. Bell Labs licensed the technology for $25,000, and soon many companies, including Motorola (1952), Shockley Semiconductor (1955), Sylvania, Centralab, Fairchild Semiconductor and Texas Instruments were making transistors. In 1958 Jack Kilby of Texas Instruments and Robert Noyce of Fairchild independently invented the Integrated Circuit, a method of producing multiple transistors on a single "chip" of Semiconductor material. This kicked off a number of rapid advances in fabrication technology leading to the exponential growth in semiconductor device production, known as Moore's law that has persisted over the past six or so decades. The industry's annual semiconductor sales revenue has since grown to over $481 billion, as of 2018.

In 2010, the semiconductor industry had the highest intensity of Research & Development in the EU and ranked second after Biotechnology in the EU, United States and Japan combined.

Complementary metal–oxide–semiconductor (CMOS /ˈsiːmɒs/ SEE-mos) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS overtook NMOS logic as the dominant MOSFET fabrication process for very large-scale integration (VLSI) chips in the 1980s, replacing earlier transistor–transistor logic (TTL) technology at the same time. CMOS has since remained the standard fabrication process for MOSFET semiconductor devices. As of 2011, 99% of IC chips, including most digital, analog and mixed-signal ICs, were fabricated using CMOS technology.

In 1948, Bardeen and Brattain patented an insulated-gate transistor (IGFET) with an inversion layer. Bardeen's concept forms the basis of CMOS technology today. The CMOS process was presented by Fairchild Semiconductor's Frank Wanlass and Chih-Tang Sah at the International Solid-State Circuits Conference in 1963. Wanlass later filed US patent 3,356,858 for CMOS circuitry and it was granted in 1967. RCA commercialized the technology with the trademark "COS-MOS" in the late 1960s, forcing other manufacturers to find another name, leading to "CMOS" becoming the standard name for the technology by the early 1970s. Two important characteristics of CMOS devices are high noise immunity and low static power consumption. Since one transistor of the MOSFET pair is always off, the series combination draws significant power only momentarily during switching between on and off states. Consequently, CMOS devices do not produce as much waste heat as other forms of logic, like NMOS logic or transistor–transistor logic (TTL), which normally have some standing current even when not changing state. These characteristics allow CMOS to integrate a high density of logic functions on a chip. It was primarily for this reason that CMOS became the most widely used technology to be implemented in VLSI chips.

Chih-Tang "Tom" Sah (simplified Chinese: 萨支唐; traditional Chinese: 薩支唐; pinyin: Sà Zhītáng; 10 November 1932 – 5 July 2025) is a Chinese-American electronics engineer and condensed matter physicist. He is best known for inventing CMOS (complementary MOS) logic with Frank Wanlass at Fairchild Semiconductor in 1963. CMOS is used in nearly all modern very large-scale integration (VLSI) semiconductor devices.

He was the Pittman Eminent Scholar and a Graduate Research Professor at the University of Florida from 1988 to 2010. He was a Professor of Physics and Professor of Electrical and Computer Engineering, emeritus, at the University of Illinois at Urbana-Champaign, where he taught for 26 years (1962-1988) and guided 40 students to the Ph.D. degree in electrical engineering and in physics and 34 MSEE theses. At the University of Florida, he guided 10 doctoral theses in EE. He has published more than 300 peer-reviewed journal articles with his graduate students and research associates, and presented about 200 invited lectures and 60 contributed papers in China, Europe, Japan, Taiwan and in the United States on transistor physics, technology and evolution.

Moore's law is the observation that the number of transistors in an integrated circuit (IC) doubles about every two years. Moore's law is an observation and projection of a historical trend. Rather than a law of physics, it is an empirical relationship. It is an experience curve effect, a type of observation quantifying efficiency gains from learned experience in production.

The observation is named after Gordon Moore, the co-founder of Fairchild Semiconductor and Intel and former Chief Executive Officer of the latter, who in 1965 noted that the number of components per integrated circuit had been doubling every year, and projected this rate of growth would continue for at least another decade. In 1975, looking forward to the next decade, he revised the forecast to doubling every two years, a compound annual growth rate (CAGR) of 41%. Moore's empirical evidence did not directly imply that the historical trend would continue; nevertheless, his prediction has held since 1975 and has since become known as a law.

Shockley Semiconductor Laboratory, later known as Shockley Transistor Corporation, was a pioneering semiconductor developer founded by William Shockley, and funded by Beckman Instruments, Inc., in 1955. It was the first high technology company, in what came to be known as Silicon Valley, to work on silicon-based semiconductor devices.

In 1957, the eight leading scientists resigned, and became the core of what would later become Fairchild Semiconductor. Shockley Semiconductor never recovered from this departure;it was purchased by Clevite in 1960, then sold to ITT in 1968, and shortly after, officially closed

Jack St. Clair Kilby (November 8, 1923 – June 20, 2005) was an American electrical engineer who took part, along with Robert Noyce of Fairchild Semiconductor, in the realization of the first integrated circuit while working at Texas Instruments (TI) in 1958. He was awarded the Nobel Prize in Physics on December 10, 2000.

Kilby was also the co-inventor of the handheld calculator and the thermal printer, for which he had the patents. He also had patents for seven other inventions.

Robert Norton Noyce (December 12, 1927 – June 3, 1990), nicknamed "the Mayor of Silicon Valley", was an American physicist and entrepreneur who co-founded Fairchild Semiconductor in 1957 and Intel Corporation in 1968. He was also credited with the realization of the first monolithic integrated circuit or microchip made with silicon, which fueled the personal computer revolution and gave Silicon Valley its name.

Noyce founded The Noyce School of Applied Computing within the College of Engineering at Cal Poly, San Luis Obispo. In 1987, President Ronald Reagan awarded him the National Medal of Technology, and in 1989, he was inducted into the U.S. Business Hall of Fame, with President George H. W. Bush delivering the keynote. In 1990, he received a Lifetime Achievement Medal alongside Jack Kilby and John Bardeen during the bicentennial celebration of the Patent Act.

The traitorous eight was a group of eight employees who left Shockley Semiconductor Laboratory in 1957 to found Fairchild Semiconductor. William Shockley had in 1956 recruited a group of young Ph.D. graduates with the goal to develop and produce new semiconductor devices. While Shockley had received a Nobel Prize in Physics and was an experienced researcher and teacher, his management of the group was authoritarian and unpopular. This was accentuated by Shockley's research focus not proving fruitful. After the demand for Shockley to be replaced was rebuffed, the eight left to form their own company.

Shockley described their leaving as a "betrayal." The eight who left Shockley Semiconductor were Julius Blank, Victor Grinich, Jean Hoerni, Eugene Kleiner, Jay Last, Gordon Moore, Robert Noyce, and Sheldon Roberts. In August 1957, they reached an agreement with Sherman Fairchild, and on September 18, 1957, they formed Fairchild Semiconductor. The newly founded Fairchild Semiconductor soon grew into a leader in the semiconductor industry. In 1960, it became an incubator of Silicon Valley and was directly or indirectly involved in the creation of dozens of corporations, including Intel and AMD. These many spin-off companies came to be known as "Fairchildren."

In microelectronics, a dual in-line package (DIP or DIL) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.

A DIP is usually referred to as a DIPn, where n is the total number of pins, and sometimes appended with the row-to-row package width "N" for narrow (0.3") or "W" for wide (0.6"). For example, a microcircuit package with two rows of seven vertical leads would be a DIP14 or DIP14N. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.