Electronic design automation

Computer-aided design (CAD) is the use of computers (or workstations) to aid in the creation, modification, analysis, or optimization of a design. This software is used to increase the productivity of the designer, improve the quality of design, improve communications through documentation, and to create a database for manufacturing. Designs made through CAD software help protect products and inventions when used in patent applications. CAD output is often in the form of electronic files for print, machining, or other manufacturing operations. The terms computer-aided drafting (CAD) and computer-aided design and drafting (CADD) are also used.

Its use in designing electronic systems is known as electronic design automation (EDA). In mechanical design it is known as mechanical design automation (MDA), which includes the process of creating a technical drawing with the use of computer software.

In the context of hardware and software systems, formal verification is the act of proving or disproving the correctness of a system with respect to a certain formal specification or property, using formal methods of mathematics. Formal verification is a key incentive for formal specification of systems, and is at the core of formal methods.It represents an important dimension of analysis and verification in electronic design automation and is one approach to software verification. The use of formal verification enables the highest Evaluation Assurance Level (EAL7) in the framework of common criteria for computer security certification.

Formal verification can be helpful in proving the correctness of systems such as: cryptographic protocols, combinational circuits, digital circuits with internal memory, and software expressed as source code in a programming language. Prominent examples of verified software systems include the CompCert verified C compiler and the seL4 high-assurance operating system kernel.

A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. PCBs are used to connect or "wire" components to one another in an electronic circuit. Electrical components may be fixed to conductive pads on the outer layers, generally by soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, metal-lined drilled holes that enable electrical interconnections between conductive layers, to boards with more than a single side.

Printed circuit boards are used in nearly all electronic products today. Alternatives to PCBs include wire wrap and point-to-point construction, both once popular but now rarely used. PCBs require additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Electronic design automation software is available to do much of the work of layout. Mass-producing circuits with PCBs is cheaper and faster than with other wiring methods, as components are mounted and wired in one operation. Large numbers of PCBs can be fabricated at the same time, and the layout has to be done only once. PCBs can also be made manually in small quantities, with reduced benefits.

The semiconductor industry is the aggregate of companies engaged in the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits. Its roots can be traced to the invention of the transistor by Shockley, Brattain, and Bardeen at Bell Labs in 1948. Bell Labs licensed the technology for $25,000, and soon many companies, including Motorola (1952), Shockley Semiconductor (1955), Sylvania, Centralab, Fairchild Semiconductor and Texas Instruments were making transistors. In 1958 Jack Kilby of Texas Instruments and Robert Noyce of Fairchild independently invented the Integrated Circuit, a method of producing multiple transistors on a single "chip" of Semiconductor material. This kicked off a number of rapid advances in fabrication technology leading to the exponential growth in semiconductor device production, known as Moore's law that has persisted over the past six or so decades. The industry's annual semiconductor sales revenue has since grown to over $481 billion, as of 2018.

In 2010, the semiconductor industry had the highest intensity of Research & Development in the EU and ranked second after Biotechnology in the EU, United States and Japan combined.

In computer engineering, logic synthesis is a process by which an abstract specification of desired circuit behavior, typically at register transfer level (RTL), is turned into a design implementation in terms of logic gates, typically by a computer program called a synthesis tool. Common examples of this process include synthesis of designs specified in hardware description languages, including VHDL and Verilog. Some synthesis tools generate bitstreams for programmable logic devices such as PALs or FPGAs, while others target the creation of ASICs. Logic synthesis is one step in circuit design in the electronic design automation, the others are place and route and verification and validation.

Design flows are the explicit combination of electronic design automation tools to accomplish the design of an integrated circuit. Moore's law has driven the entire IC implementation RTL to GDSII design flows from one which uses primarily stand-alone synthesis, placement, and routing algorithms to an integrated construction and analysis flows for design closure. The challenges of rising interconnect delay led to a new way of thinking about and integrating design closure tools.

The RTL to GDSII flow underwent significant changes from 1980 through 2005. The continued scaling of CMOS technologies significantly changed the objectives of the various design steps. The lack of good predictors for delay has led to significant changes in recent design flows. New scaling challenges such as leakage power,variability, and reliability will continue to require significant changes to the design closure process in the future. Many factors describe what drove the design flow from a set of separate design steps to a fully integrated approach, and what further changes are coming to address the latest challenges. In his keynote at the 40th Design Automation Conference entitled The Tides of EDA, Alberto Sangiovanni-Vincentelli distinguished three periods of EDA:

An application-specific integrated circuit (ASIC /ˈeɪsɪk/) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology, as MOS integrated circuit chips.

As feature sizes have shrunk and chip design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5,000 logic gates to over 100 million. Modern ASICs often include entire microprocessors, memory blocks including ROM, RAM, EEPROM, flash memory and other large building blocks. Such an ASIC is often termed a SoC (system-on-chip). Designers of digital ASICs often use a hardware description language (HDL), such as Verilog or VHDL, to describe the functionality of ASICs.

In the seven-layer OSI model of computer networking, the physical layer or layer 1 is the first and lowest layer: the layer most closely associated with the physical connection between devices. The physical layer provides an electrical, mechanical, and procedural interface to the transmission medium. The shapes and properties of the electrical connectors, the frequencies to transmit on, the line code to use and similar low-level parameters are specified by the physical layer.

At the electrical layer, the physical layer is commonly implemented in a dedicated PHY chip or, in electronic design automation (EDA), by a design block. In mobile computing, the MIPI Alliance *-PHY family of interconnect protocols are widely used.