Die (integrated circuit) in the context of Microchip

An integrated circuit (IC), also known as a microchip or simply chip, is a compact assembly of electronic circuits formed from various electronic components — such as transistors, resistors, and capacitors — and their interconnections. These components are fabricated onto a thin, flat piece ("chip") of semiconductor material, most commonly silicon. Integrated circuits are integral to a wide variety of electronic devices — including computers, smartphones, and televisions — performing functions such as data processing, control, and storage. They have transformed the field of electronics by enabling device miniaturization, improving performance, and reducing cost.

Compared to assemblies built from discrete components, integrated circuits are orders of magnitude smaller, faster, more energy-efficient, and less expensive, allowing for a very high transistor count.

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity, such as aluminium or copper.

An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by conductive wires or traces through which electric current can flow. It is a type of electrical circuit. For a circuit to be referred to as electronic, rather than electrical, generally at least one active component must be present. The combination of components and wires allows various simple and complex operations to be performed: signals can be amplified, computations can be performed, and data can be moved from one place to another.

Circuits can be constructed of discrete components connected by individual pieces of wire, but today it is much more common to create interconnections by photolithographic techniques on a laminated substrate (a printed circuit board or PCB) and solder the components to these interconnections to create a finished circuit. In an integrated circuit or IC, the components and interconnections are formed on the same substrate, typically a semiconductor such as doped silicon or (less commonly) gallium arsenide.

A microcontroller (MC, uC, or μC) or microcontroller unit (MCU) is a small computer on a single integrated circuit. A microcontroller contains one or more processor cores along with memory and programmable input/output peripherals. Program memory in the form of NOR flash, OTP ROM, or ferroelectric RAM is also often included on the chip, as well as a small amount of RAM. Microcontrollers are designed for embedded applications, in contrast to the microprocessors used in personal computers or other general-purpose applications consisting of various discrete chips.

In modern terminology, a microcontroller is similar to, but less sophisticated than, a system on a chip (SoC). A SoC may include a microcontroller as one of its components but usually integrates it with advanced peripherals like a graphics processing unit (GPU), a Wi-Fi module, or one or more coprocessors.

Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (metal oxide semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunications technologies. Microprocessors and memory chips are VLSI devices.

Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform. An electronic circuit might consist of a CPU, ROM, RAM and other glue logic. VLSI enables IC designers to add all of these into one chip.

The transistor count is the number of transistors in an electronic device (typically on a single substrate or silicon die). It is the most common measure of integrated circuit complexity (although the majority of transistors in modern microprocessors are contained in cache memories, which consist mostly of the same memory cell circuits replicated many times). The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.

Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) or laser cutting. All methods are typically automated to ensure precision and accuracy.Following the dicing process the individual silicon chips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.

During dicing, wafers are typically mounted on dicing tape which has a sticky backing that holds the wafer on a thin sheet metal frame. Dicing tape has different properties depending on the dicing application. UV curable tapes are used for smaller sizes and non-UV dicing tape for larger die sizes. Dicing saws may use a dicing blade with diamond particles, rotating at 30,000 RPM and cooled with deionized water. Once a wafer has been diced, the pieces left on the dicing tape are referred to as die, dice or dies. Each will be packaged in a suitable package or placed directly on a printed circuit board substrate as a "bare die". The areas that have been cut or sawn away, called die streets, are typically about 75 micrometres (0.003 inch) wide. Once a wafer has been diced, the die will stay on the dicing tape until they are extracted by die-handling equipment, such as a die bonder or die sorter, further in the electronics assembly process.

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

The packaging stage is followed by testing of the integrated circuit.

Processor design is a subfield of computer science and computer engineering (fabrication) that deals with creating a processor, a key component of computer hardware.

The design process involves choosing an instruction set and a certain execution paradigm (e.g. VLIW or RISC) and results in a microarchitecture, which might be described in e.g. VHDL or Verilog. For microprocessor design, this description is then manufactured employing some of the various semiconductor device fabrication processes, resulting in a die which is bonded onto a chip carrier. This chip carrier is then soldered onto, or inserted into a socket on, a printed circuit board (PCB).

In computing, a northbridge (also host bridge, or memory controller hub) is a microchip that comprises the core logic chipset architecture on motherboards to handle high-performance tasks, especially for older personal computers. It is connected directly to a CPU via the front-side bus (FSB), and is usually used in conjunction with a slower southbridge to manage communication between the CPU and other parts of the motherboard.

Historically, separation of functions between CPU, northbridge, and southbridge chips was necessary due to the difficulty of integrating all components onto a single chip die. However, as CPU speeds increased over time, a bottleneck emerged due to limitations caused by data transmission between the CPU and its support chipset. The trend for integrated northbridges began near the end of the 2000s –for example, the Nvidia GeForce 320M GPU in the 2010 MacBook Air was a northbridge/southbridge/GPU combo chip.

An integrated circuit (IC), also known as a microchip or simply chip, is a compact assembly of electronic circuits formed from various electronic components — such as transistors, resistors, and capacitors — and their interconnections.

These components are fabricated onto a thin, flat piece ("chip") of semiconductor material, most commonly silicon. Integrated circuits are integral to a wide variety of electronic devices — including computers, smartphones, and televisions — performing functions such as data processing, control, and storage. They have transformed the field of electronics by enabling device miniaturization, improving performance, and reducing cost.

Apple M1 is a series of ARM-based system-on-a-chip (SoC) designed by Apple Inc., launched in 2020. It is part of the Apple silicon series, as a central processing unit (CPU) and graphics processing unit (GPU) for its Mac desktops and notebooks, and the iPad Pro and iPad Air tablets. The M1 chip initiated Apple's third change to the instruction set architecture used by Macintosh computers, switching from Intel to Apple silicon fourteen years after they were switched from PowerPC to Intel, and twenty-six years after the transition from the original Motorola 68000 series to PowerPC. At the time of its introduction in 2020, Apple said that the M1 had "the world's fastest CPU core in low power silicon" and the world's best CPU performance per watt. Its successor, Apple M2, was announced on June 6, 2022, at Worldwide Developers Conference (WWDC).

The original M1 chip was introduced in November 2020, and was followed by the professional-focused M1 Pro and M1 Max chips in October 2021. The M1 Max is a higher-powered version of the M1 Pro, with more GPU cores and memory bandwidth, a larger die size, and a large used interconnect. Apple introduced the M1 Ultra in 2022, a desktop workstation chip containing two interconnected M1 Max units. These chips differ largely in size and the number of functional units: for example, while the original M1 has about 16 billion transistors, the M1 Ultra has 114 billion.