Wetting in the context of "Surfactants"

A surfactant is a chemical compound that decreases the surface tension or interfacial tension between two liquids, a liquid and a gas, or a liquid and a solid. The word surfactant is a blend of "surface-active agent", coined in 1950. As they consist of a water-repellent and a water-attracting part, they are emulsifiers, enabling water and oil to mix. They can also form foam, and facilitate the detachment of dirt.

Surfactants are among the most widespread and commercially important chemicals. Private households as well as many industries use them in large quantities as detergents and cleaning agents, but also as emulsifiers, wetting agents, foaming agents, antistatic additives, and dispersants.

In chemistry and materials science, ultrahydrophobic (or superhydrophobic) surfaces are highly hydrophobic, i.e., extremely difficult to wet. The contact angles of a water droplet on an ultrahydrophobic material exceed 150°. This is also referred to as the lotus effect, after the superhydrophobic leaves of the lotus plant. A droplet striking these kinds of surfaces can fully rebound like an elastic ball. Interactions of bouncing drops can be further reduced using special superhydrophobic surfaces that promote symmetry breaking, pancake bouncing or waterbowl bouncing.

A coating is a covering that is applied to the surface of an object, or substrate. The purpose of applying the coating may be decorative, functional, or both. Coatings may be applied as liquids, gases or solids e.g. powder coatings.

Paints and lacquers are coatings that mostly have dual uses, which are protecting the substrate and being decorative, although some artists paints are only for decoration, and the paint on large industrial pipes is for identification (e.g. blue for process water, red for fire-fighting control) in addition to preventing corrosion. Along with corrosion resistance, functional coatings may also be applied to change the surface properties of the substrate, such as adhesion, wettability, or wear resistance. In other cases the coating adds a completely new property, such as a magnetic response or electrical conductivity (as in semiconductor device fabrication, where the substrate is a wafer), and forms an essential part of the finished product.

Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.

During the brazing process, the filler metal flows into the gap between close-fitting parts by capillary action. The filler metal is brought slightly above its melting (liquidus) temperature while protected by a suitable atmosphere, usually a flux. It then flows over the base metal (in a process known as wetting) and is then cooled to join the work pieces together.

In physics (particularly liquid statics), the meniscus (pl.: menisci, from Greek 'crescent') is the curve in the upper surface of a liquid close to the surface of the container or another object, produced by surface tension.

A concave meniscus occurs when the attraction between the particles of the liquid and the container (adhesion) is more than half the attraction of the particles of the liquid to each other (cohesion), causing the liquid to climb the walls of the container (see Surface tension § Causes). This occurs between water and glass. Water-based fluids like sap, honey, and milk also have a concave meniscus in glass or other wettable containers.

The strength of metal oxide adhesion effectively determines the wetting of the metal-oxide interface. The strength of this adhesion is important, for instance, in production of light bulbs and fiber-matrix composites that depend on the optimization of wetting to create metal-ceramic interfaces. The strength of adhesion also determines the extent of dispersion on catalytically active metal.Metal oxide adhesion is important for applications such as complementary metal oxide semiconductor devices. These devices make possible the high packing densities of modern integrated circuits.