Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it.
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Reactive ion etching in the context of Photochemical machining
Photochemical machining (PCM), also known as photochemical milling or photo etching, is a chemical milling process used to fabricate sheet metal components using a photoresist and etchants to corrosively machine away selected areas. This process emerged in the 1960s as an offshoot of the printed circuit board industry. Photo etching can produce highly complex parts with very fine detail accurately and economically.
This process can offer economical alternatives to stamping, punching, laser or water jet cutting, or wire electrical discharge machining (EDM) for thin gauge precision parts. The tooling is inexpensive and quickly produced. This makes the process useful for prototyping and allows for easy changes in mass production. It maintains dimensional tolerances and does not create burrs or sharp edges. It can make a part in hours after receiving the drawing.