Musée des Arts et Métiers in the context of Supercomputer


Musée des Arts et Métiers in the context of Supercomputer

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⭐ Core Definition: Musée des Arts et Métiers

The Musée des Arts et Métiers (French pronunciation: [myze dez‿aʁ e metje]; English: Museum of Arts and Crafts) is an industrial design museum in Paris that houses the collection of the Conservatoire national des arts et métiers, which was founded in 1794 as a repository for the preservation of scientific instruments and inventions.

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Musée des Arts et Métiers in the context of Thermoscope

A thermoscope is a device that shows changes in temperature. A typical design is a tube in which a liquid rises and falls as the temperature changes. The modern thermometer gradually evolved from it with the addition of a scale in the early 17th century and standardisation throughout the 17th and 18th centuries.

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Musée des Arts et Métiers in the context of Basile Bouchon

Basile Bouchon (French: [basil buʃɔ̃]) (or Boachon) was a textile worker in the silk center in Lyon who invented a way to control a loom with a perforated paper tape in 1725. The son of an organ maker, Bouchon partially automated the tedious setting up process of the drawloom in which an operator lifted the warp threads using cords.

This development is considered to be the first industrial application of a semi-automated machine.

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Musée des Arts et Métiers in the context of Cray-2

The Cray-2 is a supercomputer with four vector processors made by Cray Research starting in 1985. At 1.9 GFLOPS peak performance, it was the fastest machine in the world when it was released, replacing the Cray X-MP in that spot. It was, in turn, replaced in that spot by the Cray Y-MP in 1988.

The Cray-2 was the first of Seymour Cray's designs to successfully use multiple CPUs. This had been attempted in the CDC 8600 in the early 1970s, but the emitter-coupled logic (ECL) transistors of the era were too difficult to package into a working machine. The Cray-2 addressed this through the use of ECL integrated circuits, packing them in a novel 3D wiring that greatly increased circuit density.

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