Heatsink in the context of Heat spreader


Heatsink in the context of Heat spreader

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⭐ Core Definition: Heatsink

A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with other high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity, such as aluminium or copper.

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Heatsink in the context of Rectifier

A rectifier is an electrical device that converts alternating current (AC), which periodically reverses direction, to direct current (DC), which flows in only one direction.

The process is known as rectification, since it "straightens" the direction of current. Physically, rectifiers take a number of forms, including vacuum tube diodes, wet chemical cells, mercury-arc valves, stacks of copper and selenium oxide plates, semiconductor diodes, silicon-controlled rectifiers and other silicon-based semiconductor switches. Historically, even synchronous electromechanical switches and motor-generator sets have been used. Early radio receivers, called crystal radios, used a "cat's whisker" of fine wire pressing on a crystal of galena (lead sulfide) to serve as a point-contact rectifier or "crystal detector".

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Heatsink in the context of Computer cooling

Computer cooling is required to remove the waste heat produced by computer hardware, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, hard disk drives, and solid state drives (SSDs).

Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling. Use of heatsinks cooled by airflow reduces the temperature rise produced by a given amount of heat. Attention to patterns of airflow can prevent the development of hotspots. Computer fans are widely used along with heatsink fans to reduce temperature by actively exhausting hot air. There are also other cooling techniques, such as liquid cooling. All modern day processors are designed to cut out or reduce their voltage or clock speed if the internal temperature of the processor exceeds a specified limit. This is generally known as Thermal Throttling in the case of reduction of clock speeds, or Thermal Shutdown in the case of a complete shutdown of the device or system.

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Heatsink in the context of Thermal adhesive

Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape.

It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.

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Heatsink in the context of Random-access memory

Random-access memory (RAM; /ræm/) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media (such as hard disks and magnetic tape), where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement.

In modern technology, random-access memory takes the form of integrated circuit (IC) chips with MOS (metal–oxide–semiconductor) memory cells. RAM is normally associated with volatile types of memory where stored information is lost if power is removed. The two main types of volatile random-access semiconductor memory are static random-access memory (SRAM) and dynamic random-access memory (DRAM).

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Heatsink in the context of Lead (electronics)

In electronics, a lead (/ˈld/) or pin is an electrical connector consisting of a length of wire or a metal pad (surface-mount technology) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmitting information, as when the leads from an electrocardiograph are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole electronic components are also often called pins; in ball grid array packages, they are in form of small spheres, and are therefore called "balls".

Many electrical components such as capacitors, resistors, and inductors have only two leads, while some integrated circuits can have several hundred or even more than a thousand for the largest ball grid array packages. Integrated circuit pins often either bend under the package body like a letter "J" (J-lead) or come out, down, and form a flat foot for securing to the board (S-lead or gull-lead).

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Heatsink in the context of TO-220

The TO-220 is a style of electronic package used for high-powered, through-hole components with 0.1 inches (2.54 mm) pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits.

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Heatsink in the context of List of Intel processors

This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.

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