Dual in-line package in the context of Semiconductor package

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

The packaging stage is followed by testing of the integrated circuit.

Galvanic isolation is a principle of isolating functional sections of electrical systems to prevent current flow; no direct conduction path is permitted.

Energy or information can still be exchanged between the sections by other means, such as capacitive, inductive, radiative, optical, acoustic, or mechanical coupling.

A seven-segment display is a display device for digits and some letters. It is often used in a device to display numbers – for example in a digital clock or calculator. To a lesser extent, but still common, it is used to display alphanumeric information. Since a seven-segment display tends to be less expensive than a display that can better represent any character and even a graphic image such as a dot matrix display, the design choice to use a seven-segment display is a tradeoff to minimize cost over providing richer functionality.

A DIP switch is a manual electric switch that is packaged with others in a group in a standard dual in-line package (DIP). The term may refer to each individual switch, or to the unit as a whole. This type of switch is designed to be used on a printed circuit board along with other electronic components and is commonly used to customize the behavior of an electronic device for specific situations.

DIP switches are an alternative to jumper blocks. Their main advantages are that they are quicker to change and there are no parts to lose.

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens.

Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.

Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.

Programmable Array Logic (PAL) is a family of programmable logic device semiconductors used to implement logic functions in digital circuits that was introduced by Monolithic Memories, Inc. (MMI) in March 1978. MMI obtained a registered trademark on the term PAL for use in "Programmable Semiconductor Logic Circuits". The trademark is currently held by Lattice Semiconductor.

PAL devices consisted of a small PROM (programmable read-only memory) core and additional output logic used to implement particular desired logic functions with few components.